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Enhancing prediction accuracy of liquid film flow simulations subject to numerical air trapping

  • 최세현 (Sehyun Choi, 서강대학교 일반대학원)

초록 (요약문)

The study investigates numerical air trapping and contact angle hysteresis in simulations of thin liquid films over rotating plates, phenomena critical to wafer cleaning and coating processes in the semiconductor industry. Numerical air trapping may reduce the accuracy and robustness of numerical prediction significantly. Despite extensive re- searches on physical air trapping, systematic analyses of numerical air trapping remain very limited. This study identifies non-dimensional parameters such as a novel numerical capillary number (Canum) that increase numerical air trapping. Two numerical schemes for the contact line - Navier-slip condition and novel increased surface tension method are considered as a solution. Application of these methods to film coating and wafer cleaning problems and capillary tube flows demonstrate reduced numerical air trapping and improved simulation accuracy compared experimental results in various situations. In conclusion, the reliability of multi-phase flow simulations can be enhanced using the proposed schemes.

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목차

1 Introduction 1
2 Simulation methods 4
3 Numerical air trapping and novel schemes for contact line 6
3.1 Physical air trapping in liquid film flows 6
3.2 Numerical air trapping and non-dimensional parameters 7
3.3 Analysis of parameters of numerical air trapping 10
3.4 Numerical schemes for contact line 14
3.4.1 Navier-slip condition 15
3.4.2 Increased surface tension scheme 16
4 Results 20
4.1 Film coating problem over rotating plate 20
4.1.1 Computational set-up 20
4.1.2 Analysis of different schemes for contact line 22
4.1.3 Film height and finger number ratio in 3-D coating simulation 23
4.2 Capillary tube problem 25
4.3 Liquid cleaning process over rotating wafer 29
5 Conclusions 33
References 35

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