서강대학교

목차

Chapter 1. Introduction 1
1.1 Heat dissipation mechanism and thermal conductive materials 1
1.2 High thermal conductive materials 6
1.3 Applications of thermal conductive materials 8
1.4 Composite dielectric for smartphone 11
1.5 Reference 19
Chapter 2. High thermal conductive and low dielectric constant resin 24
2.1 Introduction 24
2.1.1 Crystalline epoxy 24
2.1.2 Low dielectric constant epoxy 29
2.2 Experimental 32
2.2.1 Materials 32
2.2.2 Resin mixture fabrication 32
2.2.3 Characterization 34
2.3 Results and Discussion 38
2.3.1 The structure of epoxy and heat treatment method for crystal growth 38
2.3.2 Optimization of resin mixture by DOE(Design of experiment) 43
2.4 Conclusion 53
2.5 Reference 54
Chapter 3. 3D-Boron nitride (BN) filler and the surface treatment 58
3.1 Introduction 58
3.2 Experimental 62
3.2.1 Materials 62
3.2.2 The fabrication of the surface treated BN 62
3.2.3 The fabrication of resin-filler composite 62
3.2.4 Characterization 65
3.3 Results and Discussion 66
3.3.1 Properties of surface treated 3D-BN and epoxy composite 66
3.3.2 Optimization of filler contents 73
3.4 Conclusion 78
3.5 Reference 80
Chapter 4. Reliability test and evaluation heat dissipation performance in smartphone 87
4.1 Introduction 87
4.1.1 Reliability of PCB 87
4.1.2 The Effect of Thermal Conductivity of Materials on the Smartphones 90
4.2 Experimental 93
4.2.1 The fabrication of specimen for ion migration test 93
4.2.2 Heat dissipation performance test in the smartphone 94
4.3 Results and Discussion 97
4.3.1 The reliability test results 97
4.3.2 Heat dissipation performance of composite dielectric 101
4.4 Conclusion 107
4.5 Reference 108
Chapter 5. Conclusion 110
5.1 Conclusion 110