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D-band waveguide based two-way power combining amplifier using E-plane probe transition

  • 우홍제 (Hongje Woo, 서강대학교 일반대학원)

초록

In sub-THz bands such as D-band (110 to 170 GHz), the wavelength becomes extremely short, enabling the miniaturization of MMIC circuits and antenna components that rely on the absolute dependence of wavelength. Moreover, these bands exhibit broadband characteristics, making them advantageous for high-speed broadband wireless communication. Therefore, these frequencies are achievable for applications in fields such as radar, 6G communication, and extended reality (XR). Among them, power amplifiers have a significant role in wireless communication systems. However, as the frequency increases, the gain and achievable output power of power amplifiers are limited, which can disrupt the performance requirements of various applications. To solve this issue, the integration of multiple power amplifiers using power-combining techniques has become increasingly important. In this paper, power combining was performed using waveguides with low loss characteristics at ultra-high frequencies. When packaging the circuit inside a waveguide, a transition structure must be designed to convert the dominant electromagnetic mode of the waveguide, typically 𝑇𝐸10, into the desired mode (q- TEM) for the circuit. This paper integrates a power amplifier (PA) chip into the waveguide using an E- plane probe and achieves power combining with stepped 𝜆𝑔/4 transformer. The power measurement results of the power combiner with two PA chips show a high output power of 19.0 dBm. This represents approximately a 2.5 dB increase in power compared to a power combiner with only one PA module.

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목차

1. Introduction 1
2. Design of E-plane transition structure 6
2.1 E-plane transition structure design 6
2.2 Fabrication of E-plane transition and measurement 14
3. Design of 2-way module structure 17
3.1 Design of proposed 2-way module 17
4. Fabrication and measurement 25
4.1 D-band PA with 1-way module measurement 25
4.2 D-band PA with 2-way module measurement 32
5. Conclusion 37
Reference 38

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